ITS Electronics Inc. has complete in-house capability to perform microwave and 3D electromagnetic, mechanical and structural design, thermal and reliability analysis and simulation product layout, as well as 1,200 square foot Clean Room, which is fully equipped for production of HMIC (Hybrid Microwave Integrated Circuit) modules. These are the fundamental building blocks of products in the high frequency bands (e.g. LMDS).
The company's capabilities span the frequency spectrum from 1 to 40GHz to satisfy the most demanding requirements. ITS has invested heavily in test and assembly equipment and the latest software for computer assisted design (CAD). ITS boasts several special capabilities and technologies, including the capability to work MMICs (Monolithic Microwave Integrated Circuits) or discrete devices, as well as highly specialized packaging techniques. The facility houses microwave design and test facilities, a substrate processing facility, and photolithography equipment, as well as a surface mount manufacturing area with the latest modern test and assembly equipment.
The transmitter provides a frequency translation of an L-band input to a Ka-band output. It features high linearity, low phase noise performance and high linear power.